Answer
May 16, 2023 - 01:27 PM
While not usually necessary, you can improve heat conduction from the case to the mounting surface by using a thermal joint compound. This helps dissipate heat effectively.
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May 16, 2023 - 01:27 PM
While not usually necessary, you can improve heat conduction from the case to the mounting surface by using a thermal joint compound. This helps dissipate heat effectively.
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